The Interface in the copper Diamond-System

01.03.2007 - 28.02.2010
Research funding project
The material system copper-diamond is of technological relevance since such material would combine a high thermal conductivity with a reduced coefficient of thermal expansion. The interface is one of the main critical areas in this system as a result of the different heat conduction mechanism in copper and diamond. Electrons are responsible for the conduction of heat in copper while phonons are responsible in diamond. This is the limiting fact and therefore the theoretical predicted thermal properties cannot be achieved by a simple mixture of copper and diamond. This work will focus in a comprehensive study on the influence of various intermediate layers on the thermal transport across a copper-diamond interface. In a fist step a plane diamond substrate will be used and coated with copper. By introduction of intermediate layers with different thickness and by applying different heat treatments an improvement of the thermal transfer is expected. For the characterization of the thermal behavior of the interface a photothermal method will be used and give information which type of intermediate layer and which type of subsequent heat treatment is necessary to improve the thermal transport properties across the interface. The results achieved from the studies on the plane substrates will be transferred in a second step to the preparation of a copper-diamond composite material with improved thermal properties. A sputter deposition process will be used which allows to deposit different bond layers directly onto diamond particles of various size. The coated diamond particles will be used and compacted to a dense body. The thermal properties will be characterized and allow an indirect assessment of the thermal interface in the composite material. As a result of this research work a clear statement how the thermal transfer across the copper-diamond interface can be modified should be available.

People

Project leader

Project personnel

Institute

Grant funds

  • FWF - Österr. Wissenschaftsfonds (National) Austrian Science Fund (FWF)

Research focus

  • Composite Materials: 30%
  • Special and Engineering Materials: 20%
  • Surfaces and Interfaces: 30%
  • Materials Characterization: 20%

Keywords

GermanEnglish
Grenzflächeinterface
Kupfercopper
DiamantDiamond
WärmesenkeHeat Sink

Publications