Development of a Packaging Concept for SAW-Temperature Sensors

01.08.2003 - 31.03.2004
Assigned research project
Development and realisation of a packaging concept of SAW-temparature sensors for high temperature applications

People

Project leader

Project personnel

Institute

Contract/collaboration

  • ZZZU_CTR Carinthian Tech Research A High Tech Campus Villach

Keywords

GermanEnglish
Dickschichttechnikthick-film technology
MontagetechnikBonding technologies

Publications