The aim of the "LaReCa" project is to address the growing need in the field of nanotechnology for sensors that combine high sensitivity with high force and lateral resolution for surface analysis. Non-destructive electrical analysis of semiconductor devices at wafer level for failure analysis and process control requires sensors with lateral resolution in the nanometer range.

The task of the TU Vienna in the LaRECa project is to deposit sharp tips on a cantilever using direct write processes and thin film technologies and thus to develop an AFM sensor where the contact force can be measured and controlled in real time during the analysis. With the smallest tip radii, we enable non-destructive measurements by being able to precisely control contact pressure. With well-conducting tips, electrical contacts can be performed for electrical characterization of nanoscale semiconductor devices, and with magnetic tips, nanomagnetic characterization of nanodevices can be performed.

The high-resolution sensors generated in this way make a significant contribution to the understanding and further development of new nanoelectronic devices.