After successful completion of the course, students are able to outline industrial manufacturing processes for fabrication of electronic assemblies, to modify them for particular requirements, and to select an appropriate interconnection technique.

Lecture: Fundamentals of photolithography and of electrochemistry: wet etching, electroless metal deposition and electroplating. Application to printed circuits manufacturing and the manufacturing of assemblies and modules, laser-micromachining. interconnection technology; fundamentals of soldering (wetting of solder and effect of flux), industrial soldering techniques; adhesive bonding with filled and unfilled polymer adhesives; wire bonding and low-temperature silver sintering (bonding processes and metallurgical aspects); aging mechanisms of solder joints, adhesive bonds, and wire bonds; substrates for semiconductor chips, chip attachment, packaging of electronic components, THT (Through-Hole Technology), SMT (Surface Mounted Technology), CSP (Chip-Scale Packaging), COB (Chip On Board) etc.

Laboratory course: For instance design and fabrication of a smart electronic assembly; thermal characterization and reliability considerations. Individual subject selection directly derived from current research projects.

The content of the course is offered as lecture. Some aspects are practiced in the frame of a laboratory course.

A script is available.

Written and oral examination of the lecture course content, test and collaboration in the laboratory course, laboratory report.

Anmeldung erfolgt im Rahmen der Vorbesprechung.