366.095 Materials and Technology of Electronic Assemblies
This course is in all assigned curricula part of the STEOP.
This course is in at least 1 assigned curriculum part of the STEOP.

2020W, VU, 2.0h, 3.0EC, to be held in blocked form


  • Semester hours: 2.0
  • Credits: 3.0
  • Type: VU Lecture and Exercise
  • Format: Hybrid

Learning outcomes

After successful completion of the course, students are able to outline industrial manufacturing processes for fabrication of electronic assemblies, to modify them for particular requirements, and to select an appropriate interconnection technique.

Subject of course

Lecture: Fundamentals of photolithography and of electrochemistry: wet etching, electroless metal deposition and electroplating. Application to printed circuits manufacturing and the manufacturing of assemblies and modules, laser-micromachining. interconnection technology; fundamentals of soldering (wetting of solder and effect of flux), industrial soldering techniques; adhesive bonding with filled and unfilled polymer adhesives; wire bonding and low-temperature silver sintering (bonding processes and metallurgical aspects); aging mechanisms of solder joints, adhesive bonds, and wire bonds; substrates for semiconductor chips, chip attachment, packaging of electronic components, THT (Through-Hole Technology), SMT (Surface Mounted Technology), CSP (Chip-Scale Packaging), COB (Chip On Board) etc.

Laboratory course: For instance design and fabrication of a smart electronic assembly; thermal characterization and reliability considerations. Individual subject selection directly derived from current research projects.

Teaching methods

The content of the course is offered as lecture. Some aspects are practiced in the frame of a laboratory course.

Mode of examination

Written and oral

Additional information

A script is available.



Course dates

Sat10:00 - 14:0031.10.2020 Zoom-Meeting ID 8191392564; Passcode: 7i938f65 (LIVE)1. block: Printed circuit board technology
Sat10:00 - 14:0014.11.2020 Zoom-Meeting ID 8191392564; Passcode: 7i938f65 (LIVE)2nd block: Interconnection technology
Sat10:00 - 14:0028.11.2020 Zoom-Meeting ID 8191392564; Passcode: 7i938f65 (LIVE)3rd block: Components: Electronic packaging concepts
Sat10:00 - 14:0012.12.2020 Zoom-Meeting ID 8191392564; Passcode: 7i938f65 (LIVE)4th block: Recent research results and practical application; examination
Course is held blocked

Examination modalities

Written and oral examination of the lecture course content, test and collaboration in the laboratory course, laboratory report.

Group dates

Technologie elektronischer Baugruppen; LÜThu13:00 - 18:0004.03.2021Laborraum BB02G02 366.095 Materials and Technology of Electronic Assemblies Technologie elektronischer Baugruppen; LÜ

Course registration

Registration modalities

Anmeldung erfolgt im Rahmen der Vorbesprechung.

Group Registration

GroupRegistration FromTo
Technologie elektronischer Baugruppen; LÜ01.02.2021 09:00


Study CodeObligationSemesterPrecon.Info
066 504 Master programme Embedded Systems Not specified
066 508 Microelectronics and Photonics Not specified


No lecture notes are available.

Preceding courses

Accompanying courses