Finding analytical and numerical solutions of problems in one of the below mentioned fields. Getting insight into materials properties and calculation methods for their determination using experimentally established data.

Materials technology, electronic packaging, ceramic technology, electroplating and wet etching techniques, soldering, quality management, thermal simulation, thermal management in electronic components and assemblies.

Please visit our introductory meeting at the beginning of the semester. The course is hold in blocks which are agreed together individually. Depending on the complexity of the respective tasks students are also allowed to work in small teams.

Oral discusions with the mentor and written expertises, oral presentation of the obtained results.