366.096 Seminar Technology of Electronic Assemblies
This course is in all assigned curricula part of the STEOP.
This course is in at least 1 assigned curriculum part of the STEOP.

2020W, SE, 2.0h, 3.0EC, to be held in blocked form
TUWEL

Properties

  • Semester hours: 2.0
  • Credits: 3.0
  • Type: SE Seminar
  • Format: Online

Learning outcomes

After successful completion of the course, students are able to discuss technical questions and problems, to review the state-of-the-art in a given particular technical segment using international libraries, to extract and relate to each other technical scientific items, to apply correctly citation rules, and to present their seminar work to an interested audience.

Subject of course

Experimental assessment and modeling of properties of dielectric and conductive materials for electronic circuits and systems (base materials for electronic substrates and circuit carrier, dielectrics and conductor systems, adhesives etc.). Fabrication technologies for electronic assemblies and systems (wet etching and electroplating techniques, advanced printed circuit technology, ceramic technology, interconnection techniques, etc.). Applications for thermal, electrical and mechanical characterization of electronic assemblies, reliability assessment methods.

Teaching methods

Learning to use local libraries and web-based information services for performing a technical scientific literature research to a given particular subject, write a seminar work, prepare a presentation, and to present their work.

Mode of examination

Written

Additional information

Please consider the plagiarism guidelines of TU Wien when writing your seminar paper: Directive concerning the handling of plagiarism (PDF)

Lecturers

Institute

Course dates

DayTimeDateLocationDescription
Wed14:00 - 15:0014.10.2020 Zoom-Meeting ID 8191392564; Passcode: 7i938f65 (LIVE)Introductory meeting and registration
Course is held blocked

Examination modalities

Written seminar thesis, presentation

Course registration

Registration modalities

Anmeldung erfolgt im Rahmen der Vorbesprechung.

Curricula

Study CodeObligationSemesterPrecon.Info
066 434 Materials Sciences Not specified
066 504 Master programme Embedded Systems Not specified
066 508 Microelectronics and Photonics Not specified

Literature

No lecture notes are available.

Accompanying courses

Language

if required in English