366.096 Seminar Technology of Electronic Assemblies
This course is in all assigned curricula part of the STEOP.
This course is in at least 1 assigned curriculum part of the STEOP.

2018W, SE, 2.0h, 3.0EC

Properties

  • Semester hours: 2.0
  • Credits: 3.0
  • Type: SE Seminar

Aim of course

Selftraining in an innovative topic of material science on the basis of a literature search in international scientific journals and occasionally placement of own results from experiments of related courses (such as e.g. 366.095, 355.032, 355.040). Learning to use the university library and international research systems. Diskussion of the topic, interpretation of the own results in form of a technical report and presentation of the work.

Subject of course

Experimental assessment and modeling of properties of dielectric and conductive materials for electronic circuits and systems (base materials for electronic substrates and circuit carrier, dielectrics and conductor systems, adhesives etc.). Fabrication technologies for electronic assemblies and systems (wet etching and electroplating techniques, advanced printed circuit technology, ceramic technology etc.). Applications for thermal, electrical and mechanical characterization of electronic assemblies, reliability assessment methods.

Additional information

Please consider the plagiarism guidelines of TU Wien when writing your seminar paper: Directive concerning the handling of plagiarism (PDF)

Lecturers

Institute

Course dates

DayTimeDateLocationDescription
Thu14:00 - 15:0004.10.2018 Meetingroom ISAS, Gußhausstrasse 27-29, Room CB0102Preliminary talk

Course registration

Registration modalities

Anmeldung erfolgt im Rahmen der Vorbesprechung.

Curricula

Study CodeObligationSemesterPrecon.Info
066 434 Materials Sciences Not specified
066 504 Master programme Embedded Systems Not specified
066 508 Microelectronics and Photonics Not specified

Literature

No lecture notes are available.

Language

if required in English