Fundamental understanding of technology for fabrication of electronic assemblies and systems. This includes electrochemical processes (photolithography, wet etching, electroplating techniques) for manufacturing printed circuit boards on polymeric substrates, manufacturing electronic systems in ceramic technology, interconnection technology (soldering, adhesive bonding, wire bonding) as well as electronics packaging of components and microsystems under the particular consideration of high-power electronic modules as well as reliability aspects in dependence of the intended operation condition (temperature, humidity, chemical, mechanical requirements etc.).

Lecture:
Fundamentals of photolithography and of electrochemistry: wet etching, electroless metal deposition and electroplating. Application to printed and hybrid circuits manufacturing and the manufacturing of assemblies and modules, laser-micromachining. Thick-film technology; interconnection technology; fundamentals of soldering (wetting of solder and effect of flux), industrial soldering techniques; adhesive bonding with filled and unfilled polymer adhesives; wire bonding (bonding processes and metallurgical aspects); aging mechanisms of solder joints, adhesive bonds, and wire bonds; substrates for semiconductor chips, chip attachment, packaging of electronic components, THT (Through-Hole Technology, SMT (Surface Mounted Technology), CSP (Chip-Scale Package), COB (Chip On Board) etc.
Laboratory course:
For instance: Fabrication of a smart electronic assembly either in printed circuit technology or as a thick-film hybrid circuit (Including design, printing process, sintering process, component adjustment;
Thermal characterization and reliability considerations).

Individual subject selection directly derived from current research projects.

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