After successful completion of the course, students are able to describe and discuss thermal problems, to calculate thermal resistances, to estimate the influence of geometry and material properties on the thermal performance of electronic components and assemblies, to plan and perform simple thermal characterization experiments.

Fundamentals of heat transfer: conduction, radiation, convection. Fundamentals of thermal management with special attention to continuously advancing miniaturization and reliability requirements: Temperature, radiation, and heat flux measurements, definition and calculation of thermal resistances, thermal simulation. Application of thermal management to innovative power electronic assemblies.

Learning of thermal properties, their units, and relations. Understanding of their application to materials and electronic assemblies. Solving simple thermal problems, performing thermal measurements with miniaturized temperature sensors and thermography system at electronic components or assemblies as well as writing a laboratory report.

Interested attendees are kindly requested to joint our introductory meeting. There we will present details about the main contents and make individual appointments for lectures and laboratory courses together with the attendees. At the same time you can register to this course.

Written and oral examination of the lecture course content, test and collaboration in the laboratory course, laboratory report.