Build-up a basic understanding of relations between material properties and their atomic or molecular structure. Fundamentals of physical-electrical conversion phenomena and their application to sensors and actuators. Learn to understand the meaning of physical values like temperature, humidity, pressure, ... for an appropriate material selection. Learn to analyze and calculate reliability factors. Achieve a basic understanding of principle set-up and manufacturing technologies of passive and active components and sensors.

Thermal management, reliability parameters (aging, migration, corrosion, etc.), packaging (plastic encapsulation, hermetically sealed packages), packaging concepts (multichip modules), reliability tests and quality insurance tests. Learning by doing of industrial production processes for manufacturing electronic assemblies in surface mount technology (SMT): fabrication of printing tools, circuit carrier, application of SMT soldering processes, evaluation of processes, interconnects, and encapsulants with respect to reliability.

Interested attendees are kindly requested to joint our introductory meeting. There we will present details about the main contents and make individual appointments for lectures and laboratory courses together with the attendees. At the same time you can register to this course.