Fundamental understanding of technology for fabrication of electronic assemblies and systems. This includes electrochemical processes (photolithography, wet etching, electroplating techniques) for manufacturing printed circuit boards, thermally activated processes (sintering of ceramic and glass-based materials, diffusion at materials interfaces) for manufacturing electronic systems in thick-film technology, interconnection technology (soldering, adhesive bonding, wire bonding) as well as electronics packaging of components and microsystems under the special consideration of reliability aspects in dependence of the intended operation condition (temperature, humidity, chemical, mechanical requirements etc.).
Lecture: Fundamentals of photolithography and of electrochemistry: wet etching, electroless metal deposition and electroplating. Application to printed and hybrid circuits manufacturing and the manufacturing of assemblies and modules, laser-micromachining. Thick-film technology; interconnection technology; fundamentals of soldering (wetting of solder and effect of flux), industrial soldering techniques; adhesive bonding with filled and unfilled polymer adhesives; wire bonding (bonding processes and metallurgical aspects); aging mechanisms of solder joints, adhesive bonds, and wire bonds; substrates for semiconductor chips, chip attachment, packaging of electronic components, THT (Through-Hole Technology, SMT (Surface Mounted Technology), CSP (Chip-Scale Package), COB (Chip On Board) etc. Laboratory course: Fabrication of a smart electronic assembly either in printed circuit technology or as a thick-film hybrid circuit (Including design, printing process, sintering process, component adjustment; thermal characterization and reliability considerations).
The lecture is hold in blocks on Saturdays. The optimum schedule is agreed together in the preliminary discussion during the first meeting. Appointments concerning the time and the particular tasks of the laboratory course are found together during this introductory meeting (exact time of the first meeting please find under course dates).
Lecture: in writing and orally.
Labor: Test, personal activity during the laboratory course, and final report.
