After successful completion of the course, students are able to...
- describe the basic semiconductor fabrication processes and process modules applied in modern semiconductor circuit fabrication.
- explain integration schemes for the fabrication of integrated circuits in CMOS-, bipolar- and semiconductor power device technologies.
- follow up-to-date developments in semiconductor micro- and nanoelectronics fabrication technology.
This lecture is dedicated to students who are interested in an introduction to the technology of modern integrated semiconductor circuits and to those that want to deepen their knowledge in this subject. To reach this goal the scientific fields of semiconductor physics, semiconductor device engineering as well as semiconductor device and circuit fabrication are closely interlinked with each other. In the course, the main up-to-date semicondutor fabrication processes are presented and described in detailed. The lecture´s particular focus is on basic "unit processes," their integration into "process modules" as well as in the field of "process integration". Examples on modern integration schemes are given for CMOS-, bipolar- and power electronic circuit technologies. The contents of the lecture are complemented with concrete examples of semiconductor industry.
Lecture; Literature study on modern semiconductr integration methods and presentation of the research. Further, tutorial and solving of exercises.
...Lehrende, die an diesem Termin nicht teilnehmen können, finden unter dem Link https://owncloud.tuwien.ac.at/index.php/s/9Dki75euZK8prTM einen Leitfaden mit Schritt-für-Schritt Anleitung sowie zwei Präsentationen die einerseits die strategischen Überlegungen und andererseits die zugrundeliegenden hochschuldidaktischen Grundlagen darstellen. Weiters wurden auch in TISS Hilfetexte und Formulierungshilfen für Sie implementiert. ….
Oral exam, evaluation of literature research and presentation
Not necessary
Basic understanding of electron devices e.g. (362.072)
