360.234 Microelectronic Reliability
This course is in all assigned curricula part of the STEOP.
This course is in at least 1 assigned curriculum part of the STEOP.

2023W, SE, 2.0h, 3.0EC


  • Semester hours: 2.0
  • Credits: 3.0
  • Type: SE Seminar
  • Format: Hybrid

Learning outcomes

After successful completion of the course, students are able to

  • understand degradation mechanisms of semiconductor devices in detail.
  • Implement theoretical reliability models or characterize the reliability of various technologies metrologically (dependent on the chosen focus).

Subject of course

Application of the theoretical knowledge taught in the two VUs of this module.

Several choices:

  • Implementation of a certain reliability problem in a computer code.
  • Measurement of device reliability on one of our high-speed measuring units including data analysis.

Teaching methods

Independent work on a project.

Mode of examination


Additional information

In case you are interessted to participate this course, please contact the lecturers.

Please consider the plagiarism guidelines of TU Wien when writing your seminar paper: Directive concerning the handling of plagiarism (PDF)



Examination modalities

Presentation of the work in front of peers.

Course registration

Not necessary


Study CodeObligationSemesterPrecon.Info
066 504 Master programme Embedded Systems Not specified
066 508 Microelectronics and Photonics Not specified


No lecture notes are available.