360.232 Process Reliability in Microelectronics
This course is in all assigned curricula part of the STEOP.
This course is in at least 1 assigned curriculum part of the STEOP.

2021S, VU, 2.0h, 3.0EC


  • Semester hours: 2.0
  • Credits: 3.0
  • Type: VU Lecture and Exercise
  • Format: Distance Learning

Learning outcomes

After successful completion of the course, students are able to

  • describe material and structural degradation mechanisms in modern 3D integrated circuits.
  • physically model device degradation.
  • optimize the reliability of integrated circuits by using TCAD software packages.

Subject of course

Fundamentals of metallization and interconnect manufacturing, mechanical and electrical degradation, evaluation methodology of reliability aspects, statistical analysis of the failure behavior, studies on microstructural aspects of polycrystalline metallization, mechanical degradation of the inter-metal dielectric, reliability problems of interconnect structures for 3D integration (through-silicon-vias / solder bumps), the physical basis of electromigration and stressmigration, modeling of electromigration and stressmigration, TCAD analysis of electromigration and stressmigration as well as the optimization of metallization and interconnect structures.

Teaching methods

Lectures, in-depth study of a subtopic with subsequent presentation.

Mode of examination


Additional information

Time: Tuesday, 14:00 - 16:00
Lectures are held online using Zoom. 
Zoom link will be sent to all registered students on the day of the lecture. 
Preliminary talk and begin:March 9th, 2020



Examination modalities

Oral test after positive submission of the seminar work.

Course registration

Begin End Deregistration end
15.02.2021 08:00 08.03.2021 23:00 08.03.2021 23:00



No lecture notes are available.